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Semiconductor thermal management is becoming a bottleneck challenge that restricts further development in the electronics industry. Compromising processor thermal requirements will impact the processor performance and reliability. Heat sinks are designed to increase the available surface area of an electronic component and allow for more heat to be easily dissipated. As a result, the thermal characterization of the heat sinks plays a critical role in electronics thermal management. In this study, a flexible experimental apparatus is designed, built, and assembled to characterize and test various electronics components in different aerodynamics and thermal conditions. This novel experimental apparatus allows for controlled characterization of the various heat sinks with different heights as well as realistic scenarios with air bypass at server level. Moreover, a general guideline on precise experimental procedure to characterize air cooled heat sinks is developed. The results show that introduced method reduces the experimental error by 26%. 

As the demand for faster and more reliable data processing is increasing in our daily lives, the power consumption of electronics and, correspondingly, Data Centers (DCs), also increases. It has been estimated that about 40% of this DCs power consumption is merely consumed by the cooling systems. A responsive and efficient cooling system would not only save energy and space but would also protect electronic devices and help enhance their performance. Although air cooling offers a simple and convenient solution for Electronic Thermal Management (ETM), it lacks the capacity to overcome higher heat flux rates. Liquid cooling techniques, on the other hand, have gained high attention due to their potential in overcoming higher thermal loads generated by small chip sizes. In the present work, one of the most commonly used liquid cooling techniques is investigated based on various conditions. The performance of liquid-to-liquid heat exchange is studied under multi-leveled thermal loads. Coolant Supply Temperature (CST) stability and case temperature uniformity on the Thermal Test Vehicles (TTVs) are the target indicators of the system performance in this study. This study was carried out experimentally using a rack-mount Coolant Distribution Unit (CDU) attached to primary and secondary cooling loops in a multi-server rack. The effect of various selected control settings on the aforementioned indicators is presented. Results show that the most impactful PID parameter when it comes to fluctuation reduction is the integral (reset) coefficient (IC). It is also concluded that fluctuation with amplitudes lower than 1 ᵒC is converged into higher amplitudes 

More than ever before, data centers must deploy robust thermal solutions to adequately host the high-density and high-performance computing that is in high demand. The newer generation of central processing units (CPUs) and graphics processing units (GPUs) has substantially higher thermal power densities than previous generations. In recent years, more data centers rely on liquid cooling for the high-heat processors inside the servers and air cooling for the remaining low-heat information technology equipment. This hybrid cooling approach creates a smaller and more efficient data center. The deployment of direct-to-chip cold plate liquid cooling is one of the mainstream approaches to providing concentrated cooling to targeted processors. In this study, a processor-level experimental setup was developed to evaluate the cooling performance of a novel computer numerical control (CNC) machined nickel-plated impinging cold plate on a 1 in.  1 in. mock heater that represents a functional processing unit. The pressure drop and thermal resistance performance curves of the electroless nickel-plated cold plate are compared to those of a pure copper cold plate. A temperature uniformity analysis is done using compuational fluid dynamics and compared to the actual test data. Finally, the CNC machined pure copper one is compared to other reported cold plates to demonstrate its superiority of the design with respect to the cooling performance. 

Abstract The practice of commissioning data centers (DCs) is necessary to confirm the compliance of the cooling system to the information technology equipment (ITE) load (design capacity). In a typical DC, there are different types of ITE, each having its physical characteristics. Considering these geometrical and internal differences among ITE, it is infeasible to use the actual ITE as a self-simulator. Hence, a separate device called load bank is employed for that purpose. Load banks create a dummy thermal load to analyze, test, and stress the cooling infrastructure. Available commercial load banks do not accurately replicate a server's airflow patterns and transient heat signatures which are governed by thermal inertia, energy dissipation, flow resistance, and fan system behavior. In this study, a novel prototype of the server called server simulator was designed and built with different components to be used as a server mockup. The server simulator accurately captured air resistance, heat dissipation, and the functionality of actual server behavior. Experimental data showed up to 93% improvement in ITE passive and active flow curves using the designed server simulator compared to the commercial load bank. Furthermore, the experimental results demonstrated a below 5% discrepancy on the critical back pressure and free delivery point between the actual ITE and the designed server simulator. In addition, experimental data indicated that the developed server simulator improved the actual ITE thermal mass by 27% compared to the commercial load bank. 

Abstract An increasingly common power saving practice in data center thermal management is to swap out air cooling unit blower fans with electronically commutated plug fans, Although, both are centrifugal blowers. The blade design changes: forward versus backward curved with peak static efficiencies of 60% and 75%, respectively, which results in operation power savings. The side effects of which are not fully understood. Therefore, it has become necessary to develop an overall understanding of backward curved blowers and compare the resulting flow, pressure, and temperature fields with forwarding curved ones in which the induced fields are characterized, compared, and visualized in a reference data center which may aid data center planning and operation when making the decisions of which computer room air handler (CRAH) technology to be used. In this study, experimental and numerical characterization of backward curved blowers is introduced. Then, a physics-based computational fluid dynamics model is built using the 6sigmaroom tool to predict/simulate the measured fields. Five different scenarios were applied at the room level for the experimental characterization of the cooling units and another two scenarios were applied for comparison and illustration of the interaction between different CRAH technologies. Four scenarios were used to characterize a CRAH with backward curved blowers, during which a CRAH with forwarding curved was powered off. An alternate arrangement was examined to quantify the effect of possible flow constraints on the backward curved blower's performance. Then parametric and sensitivity of the baseline modeling are investigated and considered. Different operating conditions are applied at the room level for experimental characterization, comparison, and illustration of the interaction between different CRAH technologies. The measured data is plotted and compared with the computational fluid dynamics (CFD) model assessment to visualize the fields of interest. The results show that the fields are highly dependent on CRAH technology. The tile to CRAH airflow ratios for the flow constraints of scenarios 1, 2, 3, and 4 are 85.5%, 83.9%, 61%, and 59%, respectively. The corresponding leakage ratios are 14.5%, 16%, 38.9%, and 41%, respectively. Furthermore, the validated CFD model was used to investigate and compare the airflow pattern and plenum pressure distribution. Lastly, it is notable that a potential side effect of backward curved technology is the creation of an airflow dead zone. 

Abstract The increased power consumption and continued miniaturization of high-powered electronic components have presented many challenges to their thermal management. To improve the efficiency and reliability of these devices, the high amount of heat that they generate must be properly removed. In this paper, a three-dimensional numerical model has been developed and experimentally validated for several manifold heat sink designs. The goal was to enhance the heat sink's thermal performance while reducing the required pumping power by lowering the pressure drop across the heat sink. The considered designs were benchmarked to a commercially available heat sink in terms of their thermal and hydraulic performances. The proposed manifolds were designed to distribute fluid through alternating inlet and outlet branched internal channels. It was found that using the manifold design with 3 channels reduced the thermal resistance from 0.061 to 0.054 °C/W with a pressure drop reduction of 0.77 kPa from the commercial cold plate. A geometric parametric study was performed to investigate the effect of the manifold's internal channel width on the thermohydraulic performance of the proposed designs. It was found that the thermal resistance decreased as the manifold's channel width decreased, up until a certain width value, below which the thermal resistance started to increase while maintaining low-pressure drop values. Where the thermal resistance significantly decreased in the 7 channels design by 16.4% and maintained a lower pressure drop value below 0.6 kPa.